NIPPON GOMU KYOKAISHI
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Volume 85, Issue 2
Displaying 1-8 of 8 articles from this issue
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Special Issue for General Reviews “Materials Technology for Semiconductor Manufacturing”
Introductory Remarks
General Reviews
  • [title in Japanese]
    [in Japanese]
    2012Volume 85Issue 2 Pages 32-
    Published: 2012
    Released on J-STAGE: August 02, 2013
    DOIhttps://doi.org/10.2324/gomu.85.32
    JOURNAL FREE ACCESS
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  • Application of Polymers to Photoresist Materials
    Akimasa SOYANO
    2012Volume 85Issue 2 Pages 33-39
    Published: 2012
    Released on J-STAGE: August 02, 2013
    DOIhttps://doi.org/10.2324/gomu.85.33
    JOURNAL FREE ACCESS
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    Demands for high performance chips have been drastically increased along with the development of smart phones, tablet-PCs and so on. Scaling is an ongoing challenge to fabricate a chip with multi-functions in a limited space for semiconductor manufacturers. In accordance with the design rules, critical dimensions (CD) have shrunk in half every two years. Scaling has been realized by making a photolithography pattern finer and finer by implementing a light source that has a shorter wavelength for lithography. In the development of photoresists for each wavelength, such as g-line, i-line, KrF and ArF, it is necessary to select suitable polymer platforms in order to obtain transmittance of the wavelength being used. This report introduces the history of the development of photoresist material and describes future lithography materials such as nano-imprint lithography (NIL) and direct self-assembly (DSA) technology.
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  • Latest Technology of Stress Buffer Material for Semiconductor Application
    Kohji Katoh
    2012Volume 85Issue 2 Pages 40-45
    Published: 2012
    Released on J-STAGE: August 02, 2013
    DOIhttps://doi.org/10.2324/gomu.85.40
    JOURNAL FREE ACCESS
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    Because polyimide (PI) / polybenzoxazole (PBO) materials make semiconductor reliability drastically improved, they have been applied to stress buffer layer for over 30 years. Their purpose used to prevent IC chip from mechanical attack by molding compound filler. In recent years, PI / PBO are required to perform stress relief. In addition to this, they have come to be used as dielectric layer for Cu redistribution layer application as semiconductor package type changes. Therefore, various properties and balanced performances are necessary for PI / PBO materials.
    This paper reviews latest PI / PBO technologies in semiconductor application.
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  • Material Design and Evaluation Technology of Backgrind Tape
    Taro INADA, Masashi KUME
    2012Volume 85Issue 2 Pages 46-51
    Published: 2012
    Released on J-STAGE: August 02, 2013
    DOIhttps://doi.org/10.2324/gomu.85.46
    JOURNAL FREE ACCESS
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    Backgrind tape (BG tape) is widely used in semiconductor process to protect wafer surface as well as to prevent wafer crack. Among those tapes employed in industries, BG tape can be characterized by high precision in thickness and clean design by controlling both foreign and residual contaminations. BG tape is composed of base film and adhesive covered by release film. For base film, EVA, PET or other layered materials have been used. Some special materials were also reported for well contacting bumpy wafer surface. Adhesive is designed with acrylate in general, and material design should be cared to reduce residue. UV-curable adhesive is also used. In the technology that wafer thickness becomes thinner, BG tape will compete with other materials. Design of BG tape should be further investigated for handling ultra-thin wafer with facility.
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  • Requirements and Development Trend of Dicing Tapes
    Kazuhiro TAKAHASHI
    2012Volume 85Issue 2 Pages 52-57
    Published: 2012
    Released on J-STAGE: August 02, 2013
    DOIhttps://doi.org/10.2324/gomu.85.52
    JOURNAL FREE ACCESS
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    Dicing tapes have been used for a Si wafer singulation at the IC packaging manufacturing. During the singulation, dicing tapes need to hold dies with high adhesion simultaneously with an easy die separation from the dicing tapes with low adhesion after singulation to prevent dies from breaking. In order to meet the requirements mentioned above, UV-curable dicing tapes, which is reviewed here, have been realized with both die-holding and easy-separation functions which are able to be controlled, independently. Moreover, with the popularity of the mobile devices, a packaging density and a die thickness tend to increase and decrease, respectively. For a reduction of thin wafer breaking, new thin-wafer processes, including a laser-dicing process, have been proposed and dicing tapes are required to have additional properties to realize those thin wafer processes. In this paper, the technical trend of dicing tapes for the new applications is presented.
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  • Material Design of the Die-bonding Film Based on Polyimide/Epoxy Resin
    Takashi MASUKO
    2012Volume 85Issue 2 Pages 58-63
    Published: 2012
    Released on J-STAGE: August 02, 2013
    DOIhttps://doi.org/10.2324/gomu.85.58
    JOURNAL FREE ACCESS
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    Die-bonding films have become the key technology to realize excellent reliability, high performance, high speed and high density of the devices, as well as smaller and thinner packages. We developed a novel die-bonding film based on polyimide/epoxy resin, which are useful to the CSPs (Chip Size/Scale Package). The film showed thermoplastic behavior before curing with molten performance at high temperatures above their Tgs, and thermosetting behavior after curing with restricted flow behavior even above their Tgs. The limited flow behavior results from the network structure formation in the film. The adhesion strength of the film when used as an adhesive film between two adherents having different thermal strains was affected by two main factors: the modulus and stress relaxation property of the film. In this review, the relationship between the chemical structure of the polyimides and the various properties of the films is discussed.
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Technical Note
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