Abstract
Dicing tapes have been used for a Si wafer singulation at the IC packaging manufacturing. During the singulation, dicing tapes need to hold dies with high adhesion simultaneously with an easy die separation from the dicing tapes with low adhesion after singulation to prevent dies from breaking. In order to meet the requirements mentioned above, UV-curable dicing tapes, which is reviewed here, have been realized with both die-holding and easy-separation functions which are able to be controlled, independently. Moreover, with the popularity of the mobile devices, a packaging density and a die thickness tend to increase and decrease, respectively. For a reduction of thin wafer breaking, new thin-wafer processes, including a laser-dicing process, have been proposed and dicing tapes are required to have additional properties to realize those thin wafer processes. In this paper, the technical trend of dicing tapes for the new applications is presented.
