2016 年 2 巻 1 号 p. 121-125
Recycling of silicon chips discharged in the cell manufacturing process is said to be an urgent issue. In this study, we have succeeded in reforming to high elongation resin by adding a very small amount of silicon nanoparticles. In addition, in order to clarify the principle of the resin modifier, the performance of cured resins were compared with the commercially available silane coupling agent. From the obtained results, the performance of resin modifier was found to be judged by densitometry.