抄録
This paper focuses on the effects of the interface between epoxy resin and nano- or micro-scale silica filler. Experiments were carried out on epoxy resin containing nano- or micro-scale silica fillers (nano-composite or micro-composite) to investigate the effects of the epoxy/filler interface on the properties of water absorption, electrical insulation and fracture toughness. The results indicated that epoxy/silica filler interface has an impact on the properties of the nano- and micro-composites. Nano-composites were shown to have higher water absorption than micro-composites because water accumulated over a larger interface area. Moreover, the nano-composites with interfaces treated with a silane coupling agent showed insulation breakdown properties and fracture toughness superior to those of the base epoxy resin and the micro-composites. The chemical bonding by the silane coupling agent at the epoxy/nano-scale silica filler interface played a more important role in water absorption and insulation breakdown properties than for the micro-scale silica filler. The filler size reduction to nano-scale needs appropriate interface treatment because of its tremendously large interface area. In addition, belt-shaped area models demonstrated the improvement of insulation breakdown properties and fracture toughness from the viewpoint of encountering frequency between electrical treeing or initial cracking and fillers. It is assumed that an increase in encountering frequency prevents treeing or cracking from propagating efficiently and thus improves insulation breakdown properties and fracture toughness in the nano-composite.
