抄録
In the our study, an improvement of the tear strength of the bonded resin material using an atmospheric dielectric barrier discharge plasma treatment is described. The surface treatment experiments were carried out on the surface of the polyimid films with the air and the air with an argon as a operation gas for various treatment times. The 20 kVP-P, 2 AP-P and 45 kHz power supply was used to produce an atmospheric discharge plasma with the mixture of air and small amount of argon. The contact angle on the treated surface was significantly decreased from 40-50 degree to less than 10 degree by the this plasma treatment. This suggested the removal of the organic contaminant and the enhancement of the wettability to an adhesive. The peeling test of the bonded resin materials was adopted to study the tear strength in both cases with and without plasma treatment. The results showed that the tear strength was successfully improved by more than 3 times of that measured for the bonded un-treated films. We could conclude that the surface of the polyimid film was successfully treated by the atmospheric dielectric barrier discharge plasma and that the organic contaminants which inhibited the adhesion was removed. In addition, the adhesive property also affects rough surface effect and active effect of the surface(1)-(3). And the adhesive property can be improved by them. As a result, a significant improvement of the tear strength of the resin materials was achieved.
