Abstract
The sputtering deposition is one of the technologies that cover the surface of a substrate with functional thin film. It is known as the deposition process to prepare a dense thin film. Especially a magnetron sputtering process has high deposition rate. However, improvement in the quality and adhesion of prepared films is important issues for the magnetron sputtering because the ionization rate of the sputtered particles is very low. A high power pulsed sputtering discharge has been developed to solve these problems. In this paper, it is briefly described regarding the development of the sputtering technologies, and the study cases of Japan are introduced about the high power pulsed sputtering sources.
