Abstract
A magnetized coaxial plasma gun (MCPG) has been studied in the context of nuclear fusion research, for particle and magnetic helicity injection and spheromak formation through electromagnetically accelerated magnetized plasmoid. On the other hand, most of physical vapor deposition (PVD) techniques have been developed for surface modification and new substance composition in field of electric-appliance, material, semiconductor, etc. However, in the conventional methods, conditions of deposition are limited by productive efficiency and thermal load to the substrate. We proposed a novel PVD method by utilizing electromagnetic acceleration of MCPG. In this study, we deposited Al films on SiO2 by the method, and evaluated the deposition rate and the adhesion strength. We confirmed the adhesion strength of about 2.1 times higher than the conventional method. This method can deposit a thin film with high adhesion strength by electromagnetically accelerating particles.
