Abstract
Glass-silicon anodic bonding has been used for the fabrication of silicon micro sensors. A structural distortion during the anodic bonding process is sometimes observed and leads to the difficulty in fabricating the sensors with narrow gaps. It is considered that the distortion is mainly caused by not only the deference of thermal expansion coefficient between glass and silicon but also the structural change with the movement of ions in glass plate.
This paper describes the experimental results which shows the effects of the bonding temperature and the movement of the positive ion in glass plate. It is also demonstrated that the structural distortion can be reduced by using a thick glass plate having high rigidity.
