A Basic Study on Defect Inspection Method for ASIC Manufacturing Line

(Third Report: A Proposal of Inspection Methodology Based on Chip Cost)

Abstract

The influence of strict defect control is both the enhancement of manufacturing yield and the delivery delay due to the drop of the machine operation rate. Therefore defect inspection method must be optimized especially for ASIC manufacturing. In the second report, we formularized the inspection parameter dependence on manufacturing yield and machine cleaning cycle that may affect delivery time. In this report, we propose new cost model which can take account of manufacturing yield drop, delivery delay cost etc. The delivery delay cost is based on queuing theory. In the last section of this report, we propose inspection parameter setting methodology to minimize chip cost.