IEEJ Transactions on Industry Applications
Online ISSN : 1348-8163
Print ISSN : 0913-6339
ISSN-L : 0913-6339
Paper
Model-Based Control for Rapid Thermal Processing of Semiconductor Wafers
Ryota TakagiKang-Zhi Liu
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2011 Volume 131 Issue 2 Pages 159-165

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Abstract

In this paper, a model-based control method for RTP (Rapid Thermal Processing) system is proposed. RTP system is a device used to heat semiconductor wafers uniformly. It can heat wafers rapidly and reduce the processing time. However, it is very difficult for a RTP system to achieve the extremely stringent requirement on temperature uniformity (±1[K] or less) without suitably controlling and coordinating the radiative heat flux from the halogen lamps. In this research, the location of lamps is optimized first. Then, a feedback control system is designed which provides optimal temperature control during the thermal processing. The design is carried out based on a linearized model and H2 optimal control. The effect of sensor location is also investigated. Numerous simulations show that satisfactory performances are obtained in both the tracking and the uniformity of wafer temperature.

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© 2011 by the Institute of Electrical Engineers of Japan
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