Feasibility Study of Thermal Conductivity Simulation by Coupling between Admittance Matrix Method and Finite Element Method

Abstract

In order to simulate the thermal conductivity of a power electronics system at a large scale, we have developed a new method involving the coupling of the finite element method and the admittance (Y) matrix method. This coupling method is applied to the simple test model, and its basic feasibility is confirmed because the simulation result was obtained within 6.5% of the numerical difference with the conventional FEM result.