抄録
Elastic wave detection during Al wire bonding is demonstrated. The elastic waves emitted during the bonding process contain significant information on ultrasonic vibration, pressing load, processing time, bond power, etc. As a first step to obtaining useful information, a thin AE sensor was installed on a bonder for mass production. The sensor successfully detected the signals corresponding to the 1-cycle wire bonding. The result of the continuous wavelet transform analysis is also presented.
