Perfluorinated compound (PFC) gases, which have large global warming potentials, are widely used in plasma processing for etching and chamber cleaning. In this work, C4 F8 gas abatements in the effuluent from semiconductor manufacturing tools are examined by employing an inductively coupled plasma with multi-mode antenna. In particular, an advantage of plasma electron energy reduction is exclusively studied in PFC abatement of the effuluent.
