IEEJ Transactions on Power and Energy
Online ISSN : 1348-8147
Print ISSN : 0385-4213
ISSN-L : 0385-4213
DLC Film Formation Technologies by Applying Pulse Voltage Coupled with RF Voltage to Complicated 3-dimensional Substrates and Industrial Application
Yasuo Suzuki
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2007 Volume 127 Issue 2 Pages 349-352


A uniform plasma-based ion implantation and DLC film formation technologies on the surface of complicated 3-dimensional substrates have been developed by applying pulse voltage coupled with RF voltage to the substrates such as plastics, rubber as well as metals with the similar deposition rate. These technologies are widely applicable to both ion implantation and DLC film formation onto the automobile parts, mechanical parts and metal molds. A problem to be solved is reducing cost. The deposition rate of DLC films is expected to increase to around 10μm/hr, which is ten times larger than that of the conventional method, by hybridizing the ICP (Induction Coupling Plasma) with a plus-minus voltage source. This epoch-making technology will be able to substitute for the electro-plating method in the near future.
In this paper, the DLC film formation technology by applying both RF and pulse voltage, its applications and its prospect are presented.

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© 2007 by the Institute of Electrical Engineers of Japan
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