Development of Micro-Probe Substrate for LSI Testing

Abstract

A new type of micro-probe substrate is designed and fabricated for semiconductor chips that has high-density and fine-pitch electrode pads made by micro-machining. The probe substrate consists of an array of micro-probes 25μm high, on beams formed individually with a pitch of 110μm. It is fabricated by a micro-machining process using anisotropic silicon etching and multi-layer mask techniques.