Damage Free Dicing Method for MEMS Devices

Abstract

This paper presents a dicing method for MEMS devices without dameges during the dicing process. The method is based on bonding and detachment of a glass cap plate by using thermoplastic adhesive. Sand blast technique was used for the fabrication of glass cap plate which has concavities in the depth of 100µm. The thermoplastic adhesive was screen printed on the glass plate. The plate was thermocompression-bonded to silicon wafer at 210°C and diced to individual chips without damages from water or dicing dusts. The chip was mounted in the package while the glass cap was removed at 330°C.