A Consideration for the Evaluation of MEMS Devices Low Stress Packaging for MEMS Devices with Piezo-resistive Pressure Sensing Elements

Abstract

The performance of MEMS devices are influenced by the structure surrounding MEMS devices strongly because the output of it is small and moreover it is complex and minute structure. For such MEMS devices, low stress packaging is indispensable to high performance and high reliability. We tried to evaluate stress transmitted from the package to the chip and the offset voltage evaluation of piezoresistive pressure sensor by the finite element method. Stress buffer package structure is proposed to a result of the above. Changes of an offset voltage were able to be decreased by alleviating stress from the package to 20% of the rations so far, and it was verified that it could be applied to other piezoresistive devices.