Anisotropic Wet Etching for Micro-Fabrication

Abstract

Anisotropic wet etching process is now widely used in MEMS fabrication. The etching characteristics, mechanism of etch-pit formations on both of {100} and {111} Si surfaces, and micro pyramid formation on the etched {100} surface is described in this review paper. Advanced processes for fabricating complicated 3-D structures by wet etching are also explained.