Abstract
A novel packaging construction is newly proposed for the high-density packaging, and the three dimensional conductive pattern forming method on the vertical wall is developed and applied for the packaging. For this purpose, the spray coating and the angled exposure pattern forming technologies are examined to the vertical side wall of 600 μm height, and then the characteristics of the formed pattern are evaluated. As the result, the conductive patterns of 200 μm width and 300 μm spacing could be successfully formed on the vertical walls. The measured resistance of the pattern is within one ohm which is sufficient for the conductive wiring. The reliability of the chip package with the conductive pattern was also evaluated, and it was shown that the patterns formed by the proposed method satisfy the fundamental reliability characteristics.
