Abstract
Chip to wafer (C2W) bonding is attractive because of the flexibility for various device integration and no limitations on both wafer and chip size, which is important for MEMS ubiquitous applications as well as to reduce the production cost. We have proposed a 2-step approach for MEMS-IC size free integration by using carrier wafer. Based on our previous results, this work developed a prototype high-efficiency C2W self-alignment and temporary bonding system, which includes vacuum-chuck, micro-dispenser and X-Y hot plate stage. This paper investigated the effects of process parameters, e.g. volume of H2O, wafer temperature during self-alignment, annealing process, on alignment accuracy and temporary bonding etc. Those results presented above clearly demonstrated that the proposed approach is promising for MEMS ubiquitous applications and other consumer electric production.
