Capacitive Micromachined Ultrasonic Transducers Using Anodically Bondable Ceramic Wafer with Through-Wafer Via

Abstract

This paper describes the design and experimental results of CMUTs (Capacitive Micromachined Ultrasonic Transducers) using an anodically bondable LTCC (Low Temperature Co-fired Ceramics) wafer. Electrical connection of the CMUTs top electrode and the LTCC via were successfully performed at a time of anodic bonding by forming Au bump on the electrode. The vibration characteristics of the membrane were measured by a laser Doppler vibrometer both in the atmosphere and in the water. Ultrasonic pressure signal of CMUTs arrays was measured using hydrophone.