Development of Wafer Level Chip Size Packaging Process and its Application to the CMOS Image Sensor Module for Medical Device

Abstract

A new packaging technique has been realized and applied to the imaging module for medical endoscope. In order to realize minimal invasiveness for in-vivo medical device applications, the WL-CSP (Wafer Level-Chip Size Package) is one of the most attractive technology. However, in the field of medical device packaging, the packaging needs are diversified and required number of each package does not meet the huge sized wafer processing. In this new technique, the CMOS image sensor wafer is diced at first, and then individual image sensor chips are rearranged on another smaller handling wafer. As a result, suitable size of the handling wafer can be selected for the production volume, and lower production cost and shorter production lead time can be achieved. The packaged image sensor with new packaging technique showed no significant degration of charactristic of image sensor.