Area-selective Cu Film Growth on TiN and SiO₂ by Supercritical Fluid Deposition

Abstract

This paper reports an area-selective supercritical fluid deposition (SCFD) of Cu with supercritical CO₂ and H₂ reductant. We demonstrated an area-selective Cu SCFD on TiN pre-patterned over a SiO₂ underlayer on Si substrate. Atomic force microscopy and Auger electron spectroscopy were employed to characterize the fabricated samples. Several SCFD experiments revealed deposition dependence on the surface material as well as the proximity effect, which made the selective SCFD possible on pre-patterned metal surfaces over insulating underlayers.