Wiring Techniques for Large Size Silicon Probe Using Electroplating

Abstract

To realize an uniformization of wiring thickness on a large size silicon probe, a design of wiring to supply current and electroplating conditions were analytically and experimentally evaluated. Circuit simulations adopted with non-linear resistance elements clarified the distribution of current density on silicon probes. The voltage drop of wiring to supply current on the silicon probe was necessary to be decreased to uniformize the thickness of wirings. Thus, the resistance of wiring to supply current were decreased, and the bypass wirings were set on the silicon probe for decreasing the current distribution. As a result, the thickness of wirings was uniformized in the thick deviation of less than 1 µm on the silicon probe units. The experiments were qualitatively consistent with the circuit simulations.