Development of Dry-nano-polishing Technique using Reactive Ion Etching for Ultra Thin Titanium Wafer

Abstract

In this study, we developed a dry-nano-polishing technique using reactive ion etching for ultra thin titanium wafer. The surface of titanium coated with photoresist is polished by reactive ion etching using SF₆/C₄F₈ gas. Etching speed of titanium and photoresist were adjusted to close to each other by changing temperature and ratio of SF₆/C₄F₈ gas. By etching titanium under these conditions, the smooth surface shape of the resist was transferred to titanium. By combining with photolithography, it is possible to polish a specific part.