Problems in Fabrication of Metal Pads for Capacitive MEMS Using Hands-on Open Facility

Abstract

Metal deposition is one of the important fabrication process for the electrical wires as well as bonding pads in micrelectromechanical systems (MEMS). For the development of MEMS devices, especially in university, common facilities are sometimes used. The machine conditions in such the facility are uncontrollable, therefore the properties of deposited film are unstable. In this paper, problems of contact resistance as well as adhesion using the shared machine were reported. Finally, a method to improve the film quality using such the machine was proposed. This information is important for the MEMS device development using the hand-on facilities.