Precise Hole Array Drilling of Ceramics by Excimer Laser Photo-ablation Process

Abstract

A precise drilling technology with cross section control for use on thin ceramic materials has been developed using Excimer laser photo-ablation process. An homogenous illumination optical system and projection system of high resolution optical elements are applied to a newly designed mass production system. Homogeneity of laser energy under±5% on the mask surface has been obtained by the illumination system, making a final hole array with a distribution of exit hole diameter of 3.5±0.7μm in one processing field of 1.2×1.2mm square area. If a crack occurs in the process because of high repetition rate or high energy from the laser, productivity declines. Designing a specimen holder and He-gas assist enabled cracks to be avolded even at high repetition rate of 200Hz.
This paper describes hole array drilling technique with cross section control of ceramics by multi musk method, production system and an application.