Micro Assembly by High Rate CVD Using CW UV Laser

Abstract

We have developed micro assembly technique which uses polymer and conductive material deposited by laser CVD as adhesive. Following techniques were adopted to increase the deposition rate. Continuous wave (CW) ultraviolet (UV) laser was used. The substrate was cooled to condense the source gas on the surface. To avoid depositing on a quartz window of the chamber, N₂ gas flow was given directly under the window.
Maximum polymer deposition rate by the laser CVD system was about 10μm/min. The deposited polymer was used to bond a SMA coil actuator to a silicon-glass structure for an active catheter.
Maximum deposition rate of conductive material by the laser CVD system was about 3μm/min. The resistivity of conductive material was very high, because carbon and oxygen were contained in them. Therefore the deposited conductive material could not be utilized for micro assembly with electrical connection.