Development of Microconnectors Using 3 Dimensional Micromachining Based on Deep X-ray Lithography

Abstract

We have developed a microconnector with an automatic connecting/disconnecting mechanism employing magnetic force. The diameter and thickness of the microconnector is 2.5-mm and 2-mm, respectively. To obtain a large area and reliable connection, the terminals and guides must be perpendicular to the substrate of the microconnector and have high aspect ratios. These structures are fabricated using the LIGA-like process. The cantilever shape terminals as moving structures (7-μm-width, 80-μm-height and 300-μm-length) were fabricated using the one-layer sacrificial process. The tapered terminals and guides for the smooth connection were fabricated by micro-electro-discharge-machining combined with the LIGA-like process. We confirmed the electrical cronnection at 160mA/line and the automatic connection (disconnection) at a distance of 600-μm between opposing microconnectors.