WIRE SAW CUTTING FORCE MODELING AND CONTROL USING WIRE SAW VELOCITY

抄録

Wire saws with fixed diamond abrasive are often used to cut hard and brittle materials owning to the wire saw's narrow kerf, low cutting force, and minimal material waste. Typically, the cutting force changes during the operation since the wire motion direction continuously changes due to reciprocation. Even if the process parameters (e.g., contact length between wire and part, wire tension) are fixed, large variations in the force can lead to wire saw breakage, wafer collapse, and inferior surface roughness. This study addresses this issue by regulating the normal force via automatic adjustment of the wire velocity. Experimental studies are conducted for the wire saw machining of optical glass specimens. The results show the controller can maintain a constant normal force when machining optical glass and significantly decrease wafer surface roughness as compared to the cutting process that uses a constant wire velocity.