Reduction of Diffusion Bonding Temperature with Recrystallization at Austenitic Stainless Steel

抄録

Diffusion bonding process in low temperature is desirable for the manufacturing method of metal MEMS (Micro-Electronic-Mechanical Systems) such as metal micro-pump that the high proof stress is required. Severe plastic deformed metals having high grain boundary mobility are expected to bond in low temperature. Then, we tried to perform recrystallization and solid phase diffusion bonding at the same time. In this paper, we confirmed that the reduction of diffusion bonding temperature in severe plastic deformed SUS304 and SUS316L as compared to solution heat treated one. Especially the bonding temperature was decreased prominently in SUS304 having strain-induced martensite.