Abstract
In solder ball mounting system by electrophotography, solder ball capturing by electrostatic latent image is observed and the capturing process is discussed from the force worked on the ball estimated by numerical simulation and theoretical analysis. Solder ball observation system by high speed camera with high magnification lens is assembled and solder ball developing process is observed in detail instead of toner developing in electrophotography. Solder ball capturing mechanism by electrostatic image on photoreceptor is revealed from the observation of ball capturing and the analysis of the force acting on the ball.
