Abstract
An integrated power and substrate noise analysis environment targeting systems-on-chip (SoC) design was verified through comparison with on-chip noise measurements of a microprocessor chip in a 90-nm CMOS technology. The test chip includes 12 pairs of power and ground noise monitors within a processor and also embedds substrate noise evaluation areas with 120 probing points, realizing power and substrate noise measurements in terms of time-domain dynamic waveforms and spacial distribution. In addition to noise generation in digital circuits, noise propagation through on-chip silicon substrate and of chip package and board impedances needs to be carefully considered for quantitative and quality power noise simulation.
