ITE Technical Report
Online ISSN : 2424-1970
Print ISSN : 1342-6893
ISSN-L : 1342-6893
33.39
Session ID : IST2009-56
Conference information
Chip-to-Chip Half Duplex Data Communication at 135Mbps Over Power-Supply Rails
Takushi HASHIDAMakoto NAGATA
Author information
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Abstract
Chip-to-chip serial data communication is superposed on power supply over common Vdd/Vss connections through chip, package, and board traces. A power line transceiver demonstrates half duplex spiking communication at 135Mbps. On-chip power line LC low pass filter attenuates pseudo-differential communication spikes by more than 30dB, purifying power supply current for internal circuits. Chip-to-chip power line communication invokes supplementary diagnosis functionality to be embedded in SoCs at the time of power connection, with the reduced cost of pin counts.
Content from these authors
© 2009 The Institute of Image Information and Television Engineers
Previous article Next article
feedback
Top