[招待講演] 5μmピッチ以下の微細マイクロバンプ接合を用いた三次元積層型センサ/ディテクタ技術

元吉 真

doi:10.11485/itetr.40.24.0_33

40.24 Information Sensing Technologies(IST)

Session ID : IST2016-40

DOI https://doi.org/10.11485/itetr.40.24.0_33

Conference information

Host: Information Sensing Technologies(IST)

Name : Information Sensing Technologies(IST)

Date : August 01, 2016 - August 03, 2016

3D stacked Sensor/Detector Technology using less than 5μm Pitch Micro-Bump Connections

*Makoto Motoyoshi

Author information

Keywords: Pixel Detector , Cone Bump, NpD(Nano-Particle Deposition), micro-bump connection

CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract

This paper presents the experimental results of a pixel detector device fabricated with 3-μmφ gold cone bump connections. The cone bumps are formed by NpD (Nano-particle deposition) method. The resistance per bump is approximately 0.25Ω with a robust junction formed. The influence of the stress caused by the bump junction on the MOS characteristics is also investigated. The electron mobility of NMOS appears to be influenced by the tensile stress along the channel direction.

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