多層セラミック回路基板の寸法制御に及ぼす焼成収縮ミスマッチ (銅/セラミック) の影響

抄録

The shrinking behavior of Cu/ceramic circuit boards as it applies to controlling dimensional tolerances was studied. This report includes the shrinking behavior of ceramics and copper and of the Cu/ceramic interface. It also includes the relationship between the shrinkage of the Cu/ceramic circuit board during firing and the copper content of the laminated body (which is decided before firing). Results show that the mismatch in the onset of the components' sintering temperatures affects the microstructure of the Cu/ceramic interface. The total shrinkage mismatch causes compression stress in copper wiring. The firing shrinkage of the circuit board depends on its copper content and, as copper content increases, its shrinkage approaches that of copper paste.