1993 年 101 巻 1170 号 p. 149-153
Theoretical and experimental studies of thermal downshock testing of barium borosilicate glass (Corning Code 7059) substrate for liquid crystal display are presented. The transient thermal stress of a substrate under thermal downshock test is analyzed by both an approximate analytical solution and the finite element method. Strength and flaw severity at the edges of the substrate are evaluated in reference to the edge finishing and geometrical features of the substrate. It was found that the edge flaw severity is strongly affected by the grinding material and less so by the edge shape and the thickness of the substrate. The finite element analysis shows that fracture of the substrate normally occurs by the longitudinal mode, consistent with the experimental results.