The highly integrated monolithic microwave power amplifier module for W-CDMA (wideband code division multiple access) cellular phones were designed and fabricated taking advantage improvements in microwave materials and new developments in processing methods of thin films for applications in decoupling capacitors and choke inductors. The obtained module is ultimately downsized into 3.0mm by 3.5mm with 0.5mm in thickness. The volume is about 10 times smaller than that of the ceramic chip components assembled conventional power amplifier module.
