Journal of the Ceramic Society of Japan (日本セラミックス協会学術論文誌)
Online ISSN : 1882-1022
Print ISSN : 0914-5400
ISSN-L : 0914-5400
窒化ケイ素とAg-Cu-Ti系活性金属との接合界面の解析
志智 雄之有田 雅晴松長 正治
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1988 年 96 巻 1117 号 p. 930-934

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Surface analysis of the ceramic-steel interface joined with an active metal and brazing metal foils was carried out by SEM, TEM, EDX and XPS. The analyzed specimen was the sintered silicon nitride joined to SNCM steel by Ti metal and Ag/Cu (72/28) brazing metal.
(1) Two reaction layers were produced between Si3N4 and braze.
(2) A reaction layer facing Si3N4 (layer I) was about 300nm thick and composed mainly of titanium nitride (TiN).
(3) The other reaction layer (layer II) between layer I and the braze was composed of titanium nitride (TiN) and silicide (Ti5Si3). The thickness of this layer was about 3μm.

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