材料と環境
Online ISSN : 1881-9664
Print ISSN : 0917-0480
ISSN-L : 0917-0480
樹脂封止半導体の耐湿性試験方法
尾崎 敏範石川 雄一
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ジャーナル フリー

1991 年 40 巻 1 号 p. 57-65

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Corrosion problems of electronics conponents have been become important in the reliability of the several machines and systems. In this paper, the corrosion mechanism for plastic packaged LSI and its testing methods is discussed. It is shown the materials selection and designing for the plastic packaged LSI are protected from corrosion damage in humidity environments are seemed to actual actions.
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