抄録
An Al deposit layer on TiAl substrate was formed by electrodepositing Al and alloying it with TiAl in molten salt. Electrolysis of Al was conducted using a potentiostatic polarization method at constant potentials in an equimolar NaCl-KCl melt containing 3.5mol% AlF3 at 1023K. The mass of electrodeposited material increased with decreasing in polarization potential. Deposits formed at -1.3- -1.6V (vs. Ag/Ag+ (0.1)) built up a homogeneous layer. These deposits consisted of TiAl3. TiAl covered by the electrodeposit layer was more resistant than bare TiAl to high temperature oxidation.
