Sn濃度の高いCu-Sn合金とNbとの境界面で反応させて作るNb₃Sn導体の製作法の研究

抄録

The Nb₃Sn layer was formed at the interface between Nb and Sn-Cu alloy for a short reaction time near the temperature of 700°C. In case that the layer thickness of the Cu-Sn alloy on the surface of Nb is thicker than several μm, the Cu content of Cu-Sn alloy should be above 30 at.% to produce the Nb₃Sn layer for a short reaction time at this temperature. When the layer thickness of Cu-Sn alloy plated initially is thinner than 1μm, even a Cu-Sn alloy with a less than 10 at.% Cu can produce the Nb₃Sn by utilizing the variation of Cu concentration during reaction. The Nb₃Sn layer having T_c of 18.05 with ΔT_c of 0.05K was prepared from about 1μm thickness of 20 at.% Cu-Sn alloy reacted at the temperature of 720°C for 24h.