Molecular breeding of yeast with higher metal-adsorption capacity by expression of histidine-repeat insertion in the protein anchored to the cell wall

Hideko Kambe-Honjoh; Keisuke Ohsumi; Hitoshi Shimoi; Harushi Nakajima; Katsuhiko Kitamoto

doi:10.2323/jgam.46.113

Hideko Kambe-Honjoh, Keisuke Ohsumi, Hitoshi Shimoi, Harushi Nakajima, Katsuhiko Kitamoto

著者情報

キーワード: cell surface engineering, CWP1, histidine repeat, metal adsorption, Taka-amylase A

ジャーナルフリー

2000 年 46 巻 3 号 p. 113-117

DOI https://doi.org/10.2323/jgam.46.113

詳細

抄録

A fusion protein of hexa-histidine repeat (His) and glycosylphosphatidylinositol (GPI)-anchor region of Saccharomyces cerevisiae Cwp1 with Aspergillus oryzae Taka-amylase A (TAA) was expressed on the yeast cell surface. The expressed fusion protein (TAA-His-Cwp1) was localized on the cell wall and demonstrated amylolytic activity. In comparison with the TAA-Cwp1 expressing strain, these cells exhibited 1.6- to 2.8-fold higher adsorbing capacity for Cu²⁺, Ni²⁺, and Zn²⁺.

責任著者(Corresponding author)

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