金属組織
電析Cu–Sn–Ni合金膜の機械的特性
キーワード:
electrodeposition,
copper,
tin,
nickel,
pyrophosphate,
crystal grain refinement,
crystal orientation,
microhardness,
tensile strength
2025 年 64 巻 1 号 p. 38-43
詳細
2025 年 64 巻 1 号 p. 38-43
Cu–Sn–Ni ternary alloy thick films were electrodeposited from a basic complex bath containing potassium pyrophosphate. The crystal orientation and physical properties such as microhardness and tensile strength were evaluated. The addition of potassium pyrophosphate formed complexes with Cu2+, Sn2+, and Ni2+ ions in aqueous solution, and the electrodeposition potential was shifted to a less–noble direction. The maximum hardness (431 HV0.1) was obtained from the Cu–4.9%Sn–0.9%Ni alloy film while the maximum tensile strength (1036 MPa) was achieved with the Cu–2.4%Sn–0.3%Ni alloy film. These mechanical properties were enhanced by the solid solution of Sn and grain refinement.
