Ag–SnO2接点材の合成およびCu合金基板とのレーザ接合

渡邉 静; 大矢 拓海; 古御門 詩月; 田中 浩司

doi:10.34562/jic.64.1_71

金属組織

Ag–SnO₂接点材の合成およびCu合金基板とのレーザ接合

渡邉静, 大矢拓海, 古御門詩月, 田中浩司

著者情報

キーワード: contact material, Ag‒ SnO₂, microstructure, laser welding, Colson alloy

ジャーナルフリー

2025 年 64 巻 1 号 p. 71-76

DOI https://doi.org/10.34562/jic.64.1_71

詳細

抄録

Ag–SnO₂ contact materials were synthesized by atmospheric oxidation of Sn+Ag mixed powders. For applying laser heating to fabricating electrical contact, the morphology of SnO₂ was altered by laser irradiation and the Ag–SnO₂ was welded onto Colson alloy–substrate. All the Sn added was selectively oxidized at 1050°C and a laser irradiation promoted a dispersion of separated spherical SnO₂ particles. Ag/Cu eutectic microstructures was found near the Ag–SnO₂/Colson alloy welding interface. Mg–Ni–Si oxide film formed on Colson alloy surface remained along the interface and may cause an increase in junction electrical resistance.

責任著者(Corresponding author)

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