HYBRIDS
Online ISSN : 1884-1171
Print ISSN : 0914-2568
ISSN-L : 0914-2568
Thermal Simulation for Multichip Package
Masaru Ishizuka
Author information
JOURNAL FREE ACCESS

1990 Volume 6 Issue 4 Pages 9-14

Details
Article 1st page
Content from these authors
© The Japan Institute of Electronics Packaging
Previous article Next article
feedback
Top