Printed Circuit Board & Module Div., Toshiba Co., Ltd.
Hybrid IC Engineering Dept., Printed Circuit Board & Module Div., Toshiba Co., Ltd.
1988 Volume 3 Issue 6 Pages 362-369
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HYBRIDS
Journal of The Japan Institute of Electronics Packaging
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Journal of SHM
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