Wiring Board Production by Flocking Process of Fine Metal Fiber.

Abstract

To produce the wiring board without using liquid, the new process named“Flocking process of Fine Metal Fiber”is developed. This process uses the fine metal fiber made by“Chatter Machining”as conductor base, flock them over the adhesive patterns on the substrate, and combine them with the solder. The conductores have lower resistance 360mΩ of 1×100mm pattern than that of conductive paste, and well solderability.