Development of a Copper Clad Laminate Reinforced by a New Aramid Paper (I)

Circuit Technology

Online ISSN : 1884-118X
Print ISSN : 0914-8299
ISSN-L : 0914-8299

Development of a Copper Clad Laminate Reinforced by a New Aramid Paper (I)

Kunio NISHIMURA, Tadashi HIRAKAWA

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JOURNAL FREE ACCESS

1990 Volume 5 Issue 1 Pages 17-30

DOI https://doi.org/10.5104/jiep1986.5.17

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[in Japanese]

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© The Japan Institute of Electronics Packaging

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Journal of The Japan Institute of Electronics Packaging

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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