Abstract
Electroless copper using sodium hypophoshite as a reducing agent was applied to copper inner-layer foil treatment process. Copper film obtained from this bath was codeposited with nickel and phosphor. Influences of pH and bath temperature dependence were small and deposited film was composed with 96wt % of copper, 3wt % of nickel, and 1wt % of phosphor. The surface morphorogy obtained from the bath containing poly acetylene glycol as a surface active agent formed from dendrite to nodulus deposition. Bond strength between this film and resin showed over 1.6kg / cm for 10 minutes of deposition. This film showed excellent chemical resistance and pink-ring phenomena were completely suppressed. Furthermore this film showed the excellent electric reliability. Copper migration did not occured. Therefore, insulating resistance was not changed.
